We would like to inform that the Centre is currently calling for applications for the next matchmaking mission to Japan targeting the ICT sector(s) and organised alongside the "Embedded Technology and Internet of Things” Japan 2016 Exhibition and Conference.

Should you or one of your colleagues be interested in identifying key contacts in Japan feel free to apply, this mission might be of some support to your cluster.

I thank you in advance to also forward this call to your SME members.

Please find below more information. Should you be interested in applying feel free to contact us.

ICT Cluster & SME Matchmaking mission to Japan

Mission dates: 14 - 18 November 2016 / Application deadline: 30 June 2016

Clusters and companies operating in the following ICT-related sectors are invited to apply:

Hardware solutions - MPU/MCU, DSP, System LSI(ASSP/ASIC), IP Core, FPGA/PLD, Smart Card, Embedded Platforms, Board Computers, Wireless Networks (802.11x, Bluetooth, UWB, etc.), Interface Technologies (IEEE1394, USB, etc.), PowerSupply/Management, ICSocket, Back-Plane, etc.

Software solutions - RTOS, Device Drivers, Firmware/Middleware, Internet-Related Technolog (Browsers, etc.), Database, Security Technologies (Encryption/Decryption, etc.)

Development Environments and Tools - Programming Languages (C/C++, Java, HTML/XML, UML, Compilers/Assemblers), In-Circuit Emulator and Debugging Tools, EDA/System Design Tools, Measurement & Instruments, Project Management Tools, Configuration Management Tools

OthersSystem House, Design Service Firms, System Integration Companies, Technology Promotion Organizations, Publishers, Universities/Research Organizations, etc.

This mission will enable participants to learn about the targeted market and to identify key contacts for business or technology transfer partnerships or research collaborations.

The mission lasts 5 days and is composed of market-specific business seminars, group company visits, one-on-one meetings at the "Embedded Technology and Internet of Things” Japan 2016 Exhibition and Conference with showcase and networking events to maximize opportunities for the participants.

In addition, the mission will provide EU clusters the opportunity to benchmark with the Japanese ones during a dedicated cluster session.

Costs covered by the EU-Japan Centre:

- Tuition fees

- Transfers during group company visits and to/from Yokohama

- “Embedded Technology 2016 ” registration fee including access to the exhibition & annex hall

- “Embedded Technology 2016 ” access to the partnering area and the partnering system

- “Embedded Technology 2016 ” trade fair booth arrangements

- Interpretation

- Lunch for 3 days, welcome reception and closing cocktail

- 600 EUR grant is available for Clusters* and Small and Medium-sized Enterprises.

* Clusters member of the European Cluster Collaboration Platform (

The mission is managed by the EU-Japan Centre and funded by the European Commission.

More info on:

For queries and application please contact Diane Lula at: